Prototype breadboard 400 tie points Arduino OZY-60 white solderless for 2.54 mm modules
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Description
Solderless prototype breadboard for Arduino, Raspberry Pi, ESP8266 and ESP32
A prototype breadboard with 400 tie points is an extremely versatile and indispensable tool for building prototypes and testing electronic circuits. It features two power rails and a practical double-sided adhesive tape on the back, which greatly simplifies stable mounting and component organisation on the workbench.
The product works seamlessly with popular platforms and microcontrollers. It can be used successfully in projects based on AVR, ARM, PIC chips, and as a base for Arduino, Raspberry Pi, ESP8266 and ESP32. It is ideal support for building custom prototypes, allowing advanced electronic circuits to be built entirely without a soldering iron.
Key technical specifications
- Number of tie points: 400
- Physical dimensions: 8.5 x 5.4 x 0.85 cm
- Maximum current: 5 A
- Colour: white with clearly marked power rails
- Mounting: double-sided tape for sticking to a base
- Expansion: special clips allow boards to be joined into larger modules
Example applications
- Rapid prototyping of electronic circuits without soldering components
- Testing new sensors and modules with Arduino and Raspberry Pi microcontrollers
- Building IoT and smart home circuits using ESP8266 and ESP32 modules
- Education and teaching electronics fundamentals in schools and technical universities
- Verifying circuit behaviour before designing the final printed circuit board
Benefits
- Time savings - lightning-fast assembly and disassembly without a soldering iron or solder
- Reusability - the same components can be used in many different projects
- Scalability - joining multiple boards together allows very large circuits to be built
- Stable operation - strong double-sided tape stops the board from shifting while plugging in wires
- Versatility - standard 2.54 mm hole spacing fits most popular electronic parts
Shipping costs
The price does not include any possible payment costs
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