Topnik żel do lutowania 1,5g RMA kalafoniowy No-Clean SMT PCB AG TermoPasty

Professional RMA-class flux gel

This gel flux is a highly efficient preparation based on thickened RMA-class rosin flux. It was developed specifically for precise SMT surface-mount assembly and advanced electronics repair work. Thanks to its appropriate viscosity and stable consistency, it provides excellent adhesion to soldered components. The flux gel complies with ISO 9454 1134 and J-STD-004 - ROMO standards, which attests to its highest quality and reliability. The product features a No-Clean formula, meaning that residues after the soldering process may remain on the board without the risk of causing corrosion, provided the specifics of the technological process do not impose a requirement to wash the assemblies.

Key technical features

• Flux class: RMA (rosin)
• Standards compliance: ISO 9454 1134, J-STD-004 - ROMO
• Color: amber
• Density (at 80°C): approx. 1.0 g/cm³
• Flash point: above 150°C
• Cleaning required: No (No-Clean)
• Print life: up to 36 hours
• Tack time: up to 72 hours
• Application methods: screen, stencil, syringe dispenser

Benefits of use

The properly balanced chemical composition of the flux significantly facilitates work with fine components, minimizing the risk of defective joints and so-called cold solder joints.

• Time savings thanks to eliminating the need to wash the board after soldering is complete.
• High performance in maintaining working parameters - the product retains its properties on the stencil for many hours.
• Application stability preventing the flux from spreading beyond the target area on the printed circuit board.
• Reduced risk of damage to delicate traces thanks to the use of safe, precisely selected activators.
• Application versatility enabling work in both automated processes and during manual soldering.

Compatibility with metallic surfaces

The preparation exhibits very good wetting properties and guarantees high soldering quality on many popular coatings used in the production and repair of electronic circuits. The manufacturer declares excellent solderability on surfaces made of silver (Ag), copper (Cu), gold (Au), zinc (Zn), cadmium (Cd) as well as on classic tin-lead alloys (SnPb).

Example applications

• Assembly of components and circuits using SMT surface-mount technology.
• Service work involving safe desoldering and soldering of integrated circuits.
• Precise soldering of connectors, sockets and microcontacts on PCB printed circuit boards.
• Prototyping of electronic modules requiring manual flux application using a syringe.
• Tinning of oxidized copper traces and regeneration of solder pads.
• Repair of mobile devices and computer equipment.