Kwas lutowniczy do powierzchni niklowanych z pędzelkiem 50 ml AG Termopasty

Soldering acid for nickel-plated surfaces - 50 ml

Soldering acid with a capacity of 50 ml is a specialized chemical preparation designed to support the soldering of difficult surfaces. The product, created by the renowned company AG Termopasty, features an active formula based on orthophosphoric acid. Thanks to the integrated brush in the cap, flux application is exceptionally convenient and allows precise dosing of the right amount directly onto the soldered parts.

Key technical features

• Manufacturer: AG Termopasty
• Package capacity: 50 ml
• Composition: orthophosphoric acid (75-85%) - ≥25%, amidosulfonic (sulfamic) acid - <5%, oxalic acid - <5%
• Non-volatile substance content: min. 28%
• Preparation density: 1.2 g/cm³ (at 20°C)
• Viscosity: 19 cP (at 20°C)
• Physical properties: colorless and odorless
• Application method: brush integrated into the cap
• Standards compliance: ISO 9454 type 3311 and J-STD-004 INM0

Main benefits of use

Using a dedicated soldering acid significantly facilitates joining metals that resist standard rosin fluxes. A viscosity of 19 cP at 20°C and a density of 1.2 g/cm³ at the same temperature guarantee optimal product consistency, which makes precise application easier and ensures high repeatability and a professional workshop finish.

• High effectiveness when soldering demanding materials, especially nickel-plated coatings. The preparation contains a minimum of 28% non-volatile substances, which significantly increases the efficiency of every application.
• Precise application thanks to the appropriate viscosity and the brush built into the packaging, which prevents the liquid from spilling.
• Comfortable work resulting from the fact that the liquid is completely odorless and does not generate unpleasant fumes.
• Quality guarantee confirmed by compliance with strict international soldering standards.
• Easy cleaning - residues of the preparation after soldering can be easily removed with warm deionized water or a dedicated PCB cleaner.

Example applications

Soldering acid is essential equipment for any workstation where non-standard soldering is performed, going beyond ordinary joining of copper or brass.

• Soldering of nickel-plated surfaces and components.
• Advanced service work and electronic circuit repairs.
• Workshop DIY projects requiring the joining of metals that are difficult to work with.
• Tinning and preparing resistant or tarnished wire ends for soldering.
• Making durable joints in precision mechanics and model making.

Safety rules and method of use

The preparation should be applied in small amounts only to the intended soldering area. Due to its aggressive chemical nature, after the joining process is complete, the work area should be thoroughly rinsed with water. The product contains a strong acid - special caution is required during use. In case of any contact of the acid with the eyes, rinse them immediately with plenty of running water and seek medical attention without delay.