Kwas lutowniczy do lutowania powierzchni niklowanych 35 ml AG TermoPasty

Soldering acid for nickel-plated surfaces - 35 ml

Soldering acid with a capacity of 35 ml is a specialist chemical preparation designed to support the soldering of difficult surfaces. Created by the renowned company AG Termopasty, the product stands out with an active formula based on orthophosphoric acid. It allows precise dosing of the right amount directly onto the parts being soldered.

Key technical features

• Manufacturer: AG Termopasty
• Package capacity: 35 ml
• Composition: orthophosphoric acid (75-85%) - ≥25%, amidosulfonic (sulfamic) acid - <5%, oxalic acid - <5%
• Non-volatile substance content: min. 28%
• Preparation density: 1.2 g/cm³ (at 20°C)
• Viscosity: 19 cP (at 20°C)
• Physical properties: colorless and odorless
• Standards compliance: ISO 9454 type 3311 and J-STD-004 INM0

Main benefits of use

Using a dedicated soldering acid significantly facilitates joining metals that resist standard rosin fluxes. Viscosity of 19 cP at 20°C and a density of 1.2 g/cm³ at the same temperature guarantee an optimal product consistency, which makes precise application easier and ensures high repeatability and a neat workshop finish.

• High effectiveness when soldering demanding materials, especially nickel-plated coatings. The preparation contains a minimum of 28% non-volatile substances, which significantly increases the efficiency of every application.
• Precise application thanks to the preparation’s suitable viscosity, which prevents the liquid from spreading.
• Comfortable work resulting from the fact that the liquid is completely odorless and does not generate unpleasant fumes.
• Quality guarantee confirmed by compliance with strict international soldering standards.
• Easy cleaning - residue of the preparation after soldering can be easily removed with warm deionized water or a dedicated PCB cleaner.

Example applications

Soldering acid is essential equipment for any workstation where non-standard soldering work is performed, going beyond the usual joining of copper or brass.

• Soldering of nickel-plated surfaces and components.
• Advanced servicing and repair of electronic circuits.
• Workshop DIY projects requiring joining of metals that are difficult to work with.
• Tinning and preparing resistant or tarnished wire ends for soldering.
• Making durable joints in precision mechanics and model making.

Safety rules and method of use

The preparation should be applied in small amounts only to the intended soldering area. Due to its aggressive chemical nature, after the joining process is finished, the working area should be gradually rinsed with water. The product contains a strong acid - special caution is required during use. In case of any contact of the acid with the eyes, rinse them immediately with plenty of running water and seek medical attention without delay.